Silicon Wafer Tapes

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Wafer Back Grinding Tape

back-grinding-tape

Key Advantages

  • Strong adhesion to prevent damage due to water
  • No adhesive residue keeps adherends clean
  • High Flatness to eanble grinding process
  • Can be used with uneven surfaces (bump wafers)

Features

  • Reduced warping for ultra-thin grinding
  • Heat resistance during grinding/ polishing
  • Protect films for long duration from heat
  • Antistatic properties when peeling
  • Chemical, acid and base resistance
  • Protective function for high bumps

There are 2 main types of tape:
1) UV tapes which can be peeled without stress under UV radiation, and 2) non-UV tapes designed to be peeled withOUT UV radiation.

- The tapes properties can be customized to suit customers' applications
- Small order quantity is also possible, please inquire details.

Wafer Back Grinding Tape

back-grinding-tape

Key Advantages

  • High level of uniform expansion
  • Reduces chipping
  • Strong adhesive properties
  • Prevents whiskers
  • High Heat resistance

Features

  • Antistatic properties
  • High transparency
  • High elasticity

- These UV dicing tapes can be easily peeled off by reducing the adhesive strength through UV irradiation while increasing pick-up properties during die bonding.
- The product properites/specifications can be customized according to customers' requirements.